Glass-fibre and inorganic reinforced epoxy moulding compound

Good mechanical properties, very good electrical insulation properties and dimensional stability at high temperatures, good sealing connection on metal surfaces, excellent crack resistance under thermal shock stress, very low ion content, predominantly isotropic properties

Mediumproof encapsulation of pressure- and stress-sensitive sensors, printed circuit boards and electronic components in the automotive industry with increased demand on resistance to thermal, chemical and hydrolytic influences

This product meets the allowed upper limits for heavy metals and PCAs and also conforms to the requirements of the EU directives RoHS 2, 2002/96 (WEEE) and 2006/122 (PFOS)