Two-component encapsulating system based on polyurethane with high thermal conductivity.

This highly flexible system exhibits outstanding chemical resistance against most common acids and alkali solutions and an excellent flexibility at low temperatures.
The product processes a very low and stable dielectric constant over a wide variety of frequencies and broad temperature range.

The system is tested by Underwriters Laboratories under the File-No. E108835 at a thickness of 4 mm according to UL 94 V-0

Temperature range of use: -60°C to +120°C.

The casting resin is used with WEVONAT 385

Applications: Encapsulation and coating of pressure sensitive electrical and electronic components, e.g. sensors and SMD-equipped PCBs.