Two-component encapsulating system based on polyurethane.

This highly flexible system exhibits outstanding chemical resistance against most common acids and alkali solutions and an excellent flexibility at low temperatures.

The product processes a very low and stable dielectric constant over a wide variety of frequencies and broad temperature range. Additionally it shows very good adhesion to most plastic materials, metals and glass.

Temperature range of use: -60°C to +125°C.

The casting resin is used with WEVONAT 385 .

Applications: Encapsulation and coating of pressure sensitive electrical and electronic compo-nents, e.g. sensors and SMD-equipped PCBs.