Epoxies, Ect. 40-3901
40-3901 is a two component epoxy adhesive filled with silver. This electrically conductive epoxy resin formulation offers an easy one to one mix ratio that cures at room temperature.
40-3901 is designed for adhesive bonding in microelectronic and optoelectronic applications. Due to its excellent continuity of conductivity, it has also been used extensively in applications such as micro-wave EMI and RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connectors, circuitry, and as a cold solder.
40-3901 is formulated with pure silver (no alloys). Both the resin and hardener have silver particles dispersed.
Features:
- Electrically conductive
- Thermally conductive
- Room temperature cure
- Easy 1:1 mix ratio
- Good bond strength
40-3901 is designed for adhesive bonding in microelectronic and optoelectronic applications. Due to its excellent continuity of conductivity, it has also been used extensively in applications such as micro-wave EMI and RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connectors, circuitry, and as a cold solder.
40-3901 is formulated with pure silver (no alloys). Both the resin and hardener have silver particles dispersed.
Features:
- Electrically conductive
- Thermally conductive
- Room temperature cure
- Easy 1:1 mix ratio
- Good bond strength
一般属性
使用 Prospector 建立免費帳戶時，可造訪 Epoxies, Ect. 40-3901 的完整資料表詳細資訊。您將找到有關物理、機械和硬度規格的完整資訊
物料形态
已商用：当前有效
可用性
北美洲, 非洲和中东, 拉丁美洲, 欧洲, 亚太地区
用途
电气/电子应用领域
其他属性
填料/增强材料, 特性, 外观, 弯曲强度, 导热系数, 其他性能, 颜色, Mix Ratio by Weight (PBW), 密度, 固化时间, 储存稳定性, 支撐硬度, Lap Shear Strength, 体积电阻率
加工
Find specific processing information for Epoxies, Ect. as well as general information for the 环氧; 环氧树脂 generic family. 注册 或 登录 了解更多信息。
